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| *Customer: SPECIFICATION ITEM MODEL REVISION DATE CHIP LED DEVICE SSC-WH601 REV 0.1 (061212) [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Soldering profile 5. Outline dimension 6. Packing 7. Reel packing structure 8. Label 9. Ranks 10. Precaution for use Drawn by Checked by Approved by 12/12 12/12 12/12 SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 1/9 - Seoul Semiconductor 1. Features Package : 2.1 x 0.6 x 1.0 mm Color coordinates: X = 0.29 Tape and reel packing Y = 0.28 according to CIE 1931 2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM*1 VR Topr Tstg Value 100 30 100 5 -30 ~ 80 -40 ~ 100 (Ta=25) Unit V *1 IFM conditions: Pulse width Tw 0.1ms, Duty ratio 1/10 3. Electro-Optical Characteristics Characteristics Forward Voltage Reverse Current Luminous Intensity *2 Chromaticity Coordinates *3 Viewing angle*3 Symbol VF IR IV X Y Condition IF=20 VR=5V IF=20 IF=20 IF=20 IF=20 Min 2.9 200 0.226 0.220 Typ 3.2 340 0.290 0.280 140 Max 3.7 10 580 (Ta=25) Unit V mcd 0.321 0.310 1/2 *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 The CIE standard colorimetric system [Note] ( Tolerance : IV10%, color coordinate 0.01, VF 0.1 ) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-QP-0401-06(REV.0) WH601 - 2/9 - 4. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface temperature C Operation heating 240 150 ~ Pre-heating Temperature rise: 5C/sec. Cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 260max. for 10 seconds max. (3) Hand Soldering conditions -Not more than 3 seconds @MAX280, under Soldering iron. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 LED Surface temperature C Operation heating 260 150 ~ 120 0 Pre-heating Temperature rise: 5C/sec. MAX. Cooling: -5C/sec. 60 to 150 sec. 10 sec. WH601 - 3/9 - 5. Outline Dimension Tolerance: 0.1, (1) 1.0 0.6 0.5 0.3 Polarity Mark Unit: Cathode (1) (4) 2.1 1.7 0.3 Anode 6. Packing 1.5 +0.1 -0 2.0 0.05 1.75 0.1 4.0 0.1 0.2 0.05 0.1 0.05 2.4 3.5 (2.75) 0.5 0.05 1.15 0.05 8.0 0.2 0.8 0.1 180 +0 -3 11.4 9 0.3 2 0.2 +0.2 -0 22 13 0.2 Label 60 Tolerance: 0.2, Unit: (1) Quantity : 3000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 4/9 - 7. Reel Packing Structure Reel SSC-WH601 Lot N o ######### : 3000 Aluminum Vinyl Bag SSC-WH601 Lot N o ######### : 3000 Outer Box *Material: Paper(SW3B(B)) a 7inch 245 c CHIP LED PART : SSC-WH601 CODE : Q'YT : 30,000EA TYPE SIZE(mm) b 220 c 142 CHIP LED b a LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 5/9 - 8. Label SSC-WH601 ### Lot No CAA050331#######-## : 3000 Rank Day Month Year SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 6/9 - 9. Ranks (1) Luminous Intensity: Iv [mcd] Rank A B Iv [mcd] 200 ~ 340 340 ~ 580 Condition IF =20mA (2) Color Coordinate: x, y Rank A B C x y x y x y 1 0.226 0.220 0.245 0.250 0.263 0.280 2 0.270 0.220 0.285 0.250 0.303 0.280 3 0.285 0.250 0.303 0.280 0.321 0.310 4 0.245 0.250 0.263 0.280 0.281 0.310 Condition IF =20mA (3) Forward voltage: VF Rank A B C D VF (V) 2.9 3.1 3.3 3.5 3.1 3.3 3.5 3.7 Condition IF = 20mA SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 7/9 - Rank Division Bin No. Iv [mcd] (IF = 20 mA) Color coordinate (IF = 20 mA) VF [V] (IF = 20 mA) Rank 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SSC-QP-0401-06(REV.0) A A A A A A A A A A A A B B B B B B B B B B B B A A A A B B B B C C C C A A A A B B B B C C C C A B C D A B C D A B C D A B C D A B C D A B C D AAA AAB AAC AAD ABA ABB ABC ABD ACA ACB ACC ACD BAA BAB BAC BAD BBA BBB BBC BBD BCA BCB BCC BCD WH601 SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 8/9 - 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5~30 (2) Attention after opened However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40 Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 605. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. Humidity : 60%HR max. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 WH601 - 9/9 - |
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